Process for manufacturing conductive structures in

专利名称：Process for manufacturing conductive

structures in thick film technique

发明人：WULFF, DIETRICH, DIPL.-ING.,GRUENWALD,

WERNER, DIPL.-PHYS.,SCHMID, KURT

申请号：EP91113828.7申请日：19910817公开号：EP0476320A1公开日：19920325

摘要：In the proposed process for manufacturing conductive structures, in particularconductor track structures, in thick-film technique on a substrate, a metal-containingpaste is first applied to the substrate so as to cover the surface and then dried. Theconductive structure envisaged is then produced by firing using a suitably controlledlaser beam. Finally, the substrate is cleaned to remove the paste from the areas nottreated with the laser beam. As a result, one operating step can be saved compared withthe previous processes since the laser beam simultaneously carries out the firingoperation and produces the shape of the conductive structures.

申请人：ROBERT BOSCH GMBH

地址：POSTFACH 30 02 20; W-7000 STUTTGART 30,Postfach 30 02 20 70442 StuttgartDE

国籍：DE

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