专利名称:IC package inspection apparatus发明人:Tomohide Tokumaru,Tetsuo Abe,Morio
Misono
申请号:US08/327713申请日:19941024公开号:US05473425A公开日:19951205
摘要:An apparatus for inspecting the outward appearance of each of IC packagesstored in an embossed tape includes a drive wheel having an outer periphery about whichthe embossed tape is wound. The drive wheel is rotatable in a vertical plane for movingthe embossed tape. A pair of cameras are so mounted as to face the outer periphery ofthe drive wheel at its upwardly and downwardly moving portions, respectively, and areused to produce two different images of each IC package from two different anglesthrough a cover tape bonded to the embossed tape for enclosing the IC packages. Theapparatus prevents any diffused reflection of light by the cover tape and any inclinationof each IC package during its inspection.
申请人:SONY CORPORATION
代理机构:Hill, Steadman & Simpson
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