专利名称：ELECTROMECHANICAL DEVICE, RELATED
MANUFACTURING METHOD, AND RELATEDELECTRONIC DEVICE
发明人：WANG, Wei,ZHENG, Chao申请号：EP16207261.5申请日：20161229公开号：EP3190082A1公开日：20170712
摘要：An electromechanical device may include a first substrate, a second substrate, aconnector, and a protector. The connector may be formed of a first dielectric materialand may be positioned between the first substrate and the second substrate. A first sideof the connector may directly contact the first substrate. The protector may be formedof a second dielectric material and may directly contact a second side of the connector.
申请人：Semiconductor Manufacturing International Corporation(Shanghai),Semiconductor Manufacturing International Corporation (Beijing)
地址：No. 18, Zhangjiang Road Pudong New Area Shanghai 201203 CN,No. 18,Wenchang Road Economic and Technological Development Area, Daxing Area Beijing1000176 CN
国籍：CN,CN
代理机构：Klunker IP Patentanwälte PartG mbB
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