专利名称：A method of making a Flip Chip Solder bond
structure for devices with gold basedmetallisation
发明人：Pedder, David John,Warner, David
John,Pickering, Kim Louise
申请号：EP90303603.6申请日：19900404公开号：EP0398485B1公开日：19950809
摘要：A flip-chip solder bonding arrangement including a semiconductor substrate(40) having thereon layers of metallisation (42, 44, 46) which have a tendency to interactwith a solder material, forming on said layers of metallisation (42, 44, 46) a barriermetallisation layer (44) which is not reactive with said solder material, forming solderpads (46) on the barrier layer (44) and thereafter forming solder bonds (48) with suchsolder pads (46) employing said solder material.
申请人：GEC-MARCONI LIMITED
代理机构：Walker, Andrew John
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