Leadframe and semiconductor device

专利名称：Leadframe and semiconductor device发明人：Shintaro Hayashi申请号：US15290102申请日：20161011公开号：US09984958B2公开日：20180529

专利附图：

摘要：A semiconductor device includes a leadframe, a semiconductor chip, and anencapsulation resin encapsulating the leadframe and the semiconductor chip. Theleadframe includes a first surface and a second surface facing away from the first surface.The semiconductor chip is mounted on the first surface of the leadframe. A part of the

second surface of the leadframe is depressed toward the first surface to form a stepsurface. The step surface includes an uneven surface part where depressions are formed,and is covered with the encapsulation resin.

申请人：SHINKO ELECTRIC INDUSTRIES CO., LTD.

地址：Nagano JP

国籍：JP

代理机构：IPUSA, PLLC

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