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ELECTROCHEMICAL COUPLING OF METALLIC BIOMATERIAL I

2023-03-24 来源:客趣旅游网
专利内容由知识产权出版社提供

专利名称:ELECTROCHEMICAL COUPLING OF

METALLIC BIOMATERIAL IMPLANTS FORBIOLOGICAL EFFECT

发明人:Jeremy L. Gilbert申请号:US12534443申请日:20090803

公开号:US20110029080A1公开日:20110203

专利附图:

摘要:The invention discloses a novel method of controlling the open circuit potential(OCP) of a medical implant by coupling it with small amounts of metals having a lower

OCP than the implant. Coupling of Mg to less than 1% of the surface area of a titaniumimplant is shown to induce cathodic polarization of the titanium that inhibits cellproliferation at the surface of the implant. Mg—Ti coupling in medical devices promisesto attenuate or eliminate potential complications of surgery such as peri-implantitis andbacterial infections at the site of implantation.

申请人:Jeremy L. Gilbert

地址:Fayetteville NY US

国籍:US

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