专利名称：Thermal management of power conditioning
systems
发明人：Arthur H. Iversen申请号：US07/517222申请日：19900501公开号：US05111280A公开日：19920505
摘要：A semi-conductor assembly including an elongated electrically conductivesupport structure defining a sinuous coolant flow path between respective upper andlower surfaces of the support structure. The sinuous coolant path includes alternatingconcave and convex coolant surfaces. A first series of semi-conductor devices is secured ina thermally intimate manner to the upper surface of the support structure, and a secondseries of semi-conductor devices is secured in a thermally intimate manner to the lowersurface of the support structure. Each semi-conductor device is disposed proximate aconcave curved surface of the coolant path.
申请人：IVERSEN; ARTHUR H.
代理人：Streich Lang
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