专利名称:Polyamic acid, varnish comprising same and
polyimide film
发明人:Tatsuhiro Urakami,Masaki Okazaki,Kenichi
Fukukawa,Yoshihiro Sakata,Atsushi Okubo
申请号:US14781927申请日:20140401公开号:US09902810B2公开日:20180227
专利附图:
摘要:The present invention addresses the problem of providing: a polyimide film thathas a small phase difference in the thickness direction and has a low coefficient of linear
thermal expansion; and a polyamic acid and varnish to obtain the same. In order to solvethis problem, the present invention provides a polyimide film which comprises polyimidethat is produced by reacting a diamine component and a tetracarboxylic dianhydridecomponent, the polyimide film having a coefficient of linear thermal expansion of 35ppm/K or less over a temperature range of 100 to 200 DEG C, an absolute value of phasedifference in the thickness direction of 200 nm or less per 10 μm thickness, a glasstransition temperature of 260 DEG C or more, and a total light transmittance of 85% ormore.
申请人:MITSUI CHEMICALS, INC.
地址:Minato-ku, Tokyo JP
国籍:JP
代理机构:Buchanan, Ingersoll & Rooney PC
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