专利名称：POLYAMIDE-IMIDE COPOLYMER FILM AND
METHOD OF PREPARING POLYAMIDE-IMIDECOPOLYMER
发明人：PARK, HYO JUN,JUNG, HAK GEE申请号：EP12880086申请日：20120625公开号：EP2864400A4公开日：20160224
摘要：Disclosed herein is a kind of polyamide-imide copolymer films, it includes TFDB(2 cellular constructions are originated from copolymer, 2 '-bis-trifluoromethyl-4,4benzidines), from 6FDA (4 cellular constructions, 4-(hexafluoroisopropyli,ene) diphthalicanhydrides) and derive from TPC (terephthalyl chloride cellular constructions;Isosorbide-5-Nitrae-benzenedicarbonyl chlorides) copolymerization.
申请人：KOLON INDUSTRIES, INC.
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容