专利名称：Manufacturing method for integrating a
shunt resistor into a semiconductor package
发明人：Ubol Udompanyavit,Sreenivasan K.
Koduri,Gerald William Steele,Jason MarcCole,Steven Kummerl
申请号：US12165932申请日：20080701公开号：US07847391B2公开日：20101207
专利附图：
摘要：An integrated circuit package that comprises a lead frame, an integrated circuit
located on the lead frame and a shunt resistor coupled to the lead frame and to theintegrated circuit. The shunt resistor has a lower temperature coefficient of resistancethan the lead frame, and the lead frame has a lower resistivity than the shunt resistor.The shunt resistor has a low-resistance coupling to external leads of the lead frame, or,the shunt resistor has its own integrated external leads.
申请人：Ubol Udompanyavit,Sreenivasan K. Koduri,Gerald William Steele,Jason MarcCole,Steven Kummerl
地址：Plano TX US,Allen TX US,Tucson AZ US,Sahuarita AZ US,Carrollton TX US
国籍：US,US,US,US,US
代理人：Yingsheng Tung,Wade J. Brady, III,Frederick J. Telecky, Jr.
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