Manufacture of lapping board

专利名称：Manufacture of lapping board发明人：Kazumasa Ohnishi申请号：US10852145申请日：20040525公开号：US07303599B2公开日：20071204

专利附图：

摘要：A method for manufacturing a lapping board having abrasive grains fixed on itssurface, which is performed by the steps of: preparing a rotatable metal board having asurface of soft metal, an abrasive slurry-supplying tool arranged over the surface of themetal board, an abrasive-pressing tool which is placed on the metal board and has a hard

surface, and a ultrasonic oscillation-generating tool attached to either or both of theabrasive-pressing tool and the metal board; rotating the metal board while supplying anabrasive slurry onto the surface of the metal board and while supplying electric power tothe ultrasonic oscillation-generating tool to generate and apply ultrasonic oscillation toeither or both of the abrasive-pressing tool and the metal board, whereby introducingthe supplied abrasive slurry between the metal board and the abrasive-pressing tool andpartly embedding some abrasive grains onto the metal board; and removing unfixedabrasive grains from the metal board.

申请人：Kazumasa Ohnishi

地址：121-35, Hanazonohigashi 2-chome Nagaoka-shi, Niigata, 940-0846 JP

国籍：JP

代理机构：Nixon Peabody LLP

代理人：Jeffrey L. Costellia

更多信息请下载全文后查看