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METHOD OF FORMING MOLDED STANDOFF STRUCTURES ON IN

2024-04-06 来源:客趣旅游网
专利内容由知识产权出版社提供

专利名称:METHOD OF FORMING MOLDED STANDOFF

STRUCTURES ON INTEGRATED CIRCUITDEVICES

发明人:Frank Hall,James Voelz申请号:US11772452申请日:20070702

公开号:US20090011544A1公开日:20090108

专利附图:

摘要:A method of forming molding standoff structures on integrated circuit devicesis disclosed which includes forming a plurality of standoff structures on a substantiallyrectangular sheet of transparent material and, after forming the standoff structures,singulating the substantially rectangular sheet of transparent material into a plurality ofindividual transparent members, each of which comprise at least one of the plurality ofstandoff structures.

申请人:Frank Hall,James Voelz

地址:Boise ID US,Meridian ID US

国籍:US,US

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