专利名称:METHOD OF FORMING MOLDED STANDOFF
STRUCTURES ON INTEGRATED CIRCUITDEVICES
发明人:Frank Hall,James Voelz申请号:US11772452申请日:20070702
公开号:US20090011544A1公开日:20090108
专利附图:
摘要:A method of forming molding standoff structures on integrated circuit devicesis disclosed which includes forming a plurality of standoff structures on a substantiallyrectangular sheet of transparent material and, after forming the standoff structures,singulating the substantially rectangular sheet of transparent material into a plurality ofindividual transparent members, each of which comprise at least one of the plurality ofstandoff structures.
申请人:Frank Hall,James Voelz
地址:Boise ID US,Meridian ID US
国籍:US,US
更多信息请下载全文后查看
因篇幅问题不能全部显示,请点此查看更多更全内容