专利名称：High-density, integrated circuit chip package发明人：SANJEEV SATHE,BAHGAT
SAMMAKIA,MORRIS ANSCHEL
申请号：AU5866596申请日：19960521公开号：AU5866596A公开日：19971209
摘要：A high-density package for integrated circuit chips (20) is provided. A plurality ofintegrated circuit chips (20) are mounted on opposite sides of a thermally conductivemember (10) which serves as a stiffener for the package. A carrier member (30) isprovided with a preselected, electrically conductive pattern, and is arranged to face asurface of each of the integrated circuit chips (20) and to be electrically thereto. Thisforms a compact package with heat dissipation properties.
申请人：IBM CORPORATION,SANJEEV SATHE,BAHGAT SAMMAKIA,MORRIS ANSCHEL
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