Highly conductive molding compounds having an incr

专利名称：Highly conductive molding compounds

having an increased distribution of large sizegraphite particles

发明人：Kurt I. Butler申请号：US10135955申请日：20020429

公开号：US20030168638A1公开日：20030911

摘要：The invention provides a resin matrix with high loadings of a conductive filler;various additional additives, such as initiators, mold-release agents, shrink control

additives, and carbon black; and optionally one or more rheological agents selected fromthe group comprising group II oxides, alkaline earth oxides, carbodiamides,

polyisocynates, polyethylene and polytetraethylene fluoroethylene. The conductive filleris an inorganic filler which is desirably particulate graphite having a significant distributionof large particles such as for example, 95% in the range of about 150 to about 1000microns with over about 40%, and more particularly about 50% or even 60% over 200microns, or over 300 microns, or even over 600 microns. Conductive polymers may beused as a conductivity enhancer with the graphite. In addition, silver coated ceramic fiberscan be added to improve the overall electrical properties. Fuel cell plates can be madefrom these compositions. Fuel cell plates can be made from these compositions.

申请人：BUTLER KURT I.

更多信息请下载全文后查看