Encapsulation method for packaging semiconductor c

专利名称：Encapsulation method for packaging

semiconductor components with externalleads

发明人：Limin Wang,Lei Shi,Liang Zhao,Feng Ye申请号：US12592597申请日：20091130公开号：US07943424B1公开日：20110517

专利附图：

摘要：This invention discloses a method for packaging a semiconductor device withleads extending outside its encapsulation. The method comprises the following steps:

Step 1, providing a lead frame comprising a plurality of lead frame units arranged in twodimensional array, each lead frame unit comprising a die pad and a plurality of leadslocated along two opposite sides of the die pad, attaching a semiconductor chip onto thedie pad and electrically connecting the electrodes on each chip to its correspondingleads; Step 2, Encapsulating the chips, the die pads, and the leads with molding materialinto a plurality of one dimensional plastic encapsulation bars with the leads of each leadframe unit extending out along two opposite sides of the plastic encapsulation barsconnecting to a plurality of tie bars substantially parallel to the plastic encapsulationbars; Step 3, Trimming off the tie bars therefore cutting off the connections between theleads to the tie bars while preserving a portion of the leads extending out of the plasticencapsulation bars; and Step 4, Sawing through the plastic encapsulation bars to form aplurality of individual semiconductor components with leads extending outside itsencapsulation.

申请人：Limin Wang,Lei Shi,Liang Zhao,Feng Ye

地址：Songjiang Export Process Zone CN,Songjiang Export Process Zone CN,SongjiangExport Process Zone CN,Songjiang Export Process Zone CN

国籍：CN,CN,CN,CN

代理人：Bo-In Lin

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