This procedure outlines an in-process QA Auditing Procedure and assures the variable parameters stated in the process are under control. The goal is to monitor and control the parameters within specified condition and prevent the process defects happened on assemblies and lead to yield loss. This procedure also provides instructions for how to take corrective actions when any parameter is out of the specific control limited .
这份流程定义出 制程 QA 稽核流程, 确保在制程中的变动的参数得当控制. 目标是监控和控制参数在规定的范围内, 以防止制程不良发生于组装中, 而导致良率的流失. 这份流程亦提供了指导: 当任何参数不在规定的范围内, 怎样采取改善行动.
This procedure applies to manufacturing of all products in CSS.
这个流程适用于 CSS 中所有产品的制造.
3.1 Quality Assurance
3.1.1 Quality Assurance department (QA) is responsible to maintenance this procedure.
QA auditor must record any non-conformance,and issue the C/A or SLO to request investigation and corrective action if any of non-conformance was found.
品保部负责维护此流程. 品保部的稽核者必须将任何不符合的项目,发出通知 C/A or SLO, 并要求调查和提供改善行动.
3.1.2 Customer Quality Engineer(CQE)/QA supervisor shall verify the effectiveness of corrective action. 客户质量工程师( CQE ) / QA 的主管必须核对改善行动的有效性.
3.2 Production 生产线
3.2.1 To collect data, record and/or plot into the control chart timely, feedback to responsible engineer immediately if any out-of-control conditions are observed.
收集资料,数据, 或即时地绘制入控制图, 如果有任何超出规格的情形出现, 必须回馈给相关的责任工程师.
3.2.2 Response the C/A and SLO issued by IPQA and inform the responsible person to find out the root cause and corrective action.
由 IPQA 发出 C/A 和 SLO, 通知责任人去寻找原因和采取改善行动.
3.3 PE/EE/ME
3.3.1 Help production line to analyze the root cause of non-conformance.
帮助生产线找出不符合项的真正的原因.
3.3.2 Take immediate C/A for any non-conformance or SPC out of control limit.
对于不符合项, 或 超出SPC 规格的, 采取马上的改善措施.
3.3.3 Response the C/A and SLO issued by IPQA if need.
如果需要, 反应 C/A 和 SLO.
4.1 IPQA surveillance audit IPQA 稽核
4.1.1 Solder Paste Handling (Refer to CELQ-075-PPOC-343)
锡浆处理( 参考 CELQ-075-PROC-343)
Production shall monitor and record the data of solder paste storage temperature at least one time every shift (CELQ-075-Form-265).
生产线必须监控和记录锡浆存储的温度, 每个班次至少一次.
4.1.2 Solder Paste Screen Printing
锡浆印刷
Production shall randomly take out PCBs or panels at least per 2 hours after solder paste printing for each printer and measure the thickness of solder paste, record and plot the data into Shewhart Control Chart (CELQ-075-FORM-264).
生产线必须每两个小时随机地取出 PCBS 或 panels,测量其锡浆的厚度, 记录和绘制资料入 Shewhart Control Chart ( CELQ-075-FORM-264)
4.1.3 Solder Reflow (Refer to CELQ-075-PROC-351)
Production must test the reflow profile every day and retest when changing model. Profile shall be print out and approved by responsible person, then file up.
每一天, 生产线必须测量温度曲线; 当改变机种时,亦得重新测量温度曲线;列印出来并得到相关责任人的同意,然后存档.
4.1.4 Aqueous Cleaning Machine (if available)
Production shall record the aqueous cleaning machine parameter value into the relative form when they use(Except \"No Clean Flux\"PCBAs).
当使用 aqueous 清洗机器时, 生产线必须记录机器的参数设置入相应的表格中( 使用免洗松香的 PCBAs 不用 )
4.1.5 Ball Grid Array (BGA) Solderability BGA 的焊锡质量
Production shall inspect BGA solderability with X-ray inspection machine for open, short and solder ball accord to the PMP document of respective product. Prodution record the result into the Attribute Control Chart (CELQ-075-FORM-266)
生产线依据 PMP 等等相关文件,用 X-ray 检查BGA 的焊锡状况, 看有无开锡,短路,和锡球, 并记录结果于 记数控制表 ( CELQ-075-FORM-266 )
4.1.6 Wave Soldering (Refer to CELQ-075-PROC-405) 波峰焊
Production shall test the wave soldering profile per daily basis and retest profile while model changed. Profile shall be print out and approved by responsible person, then file up.
产线必须每天测量温度曲线,当改变机种时,亦得重新测量温度曲线;列印出来并得到相关责任人的同意,然后存档.
4.1.7 IPQA perform the surveillance audit for above process beginning of shift and model change-over. Perform ad hoc audit.and record the result in the IPQA audit form which stated in para. 7.0 .
IPQA 在开拉和转拉时对上述流程执行特别检查和记录结果于相应的下文7.0 所列出的IPQA 审核表格.
4.2 IPQA sampling audit IPQA 抽样检验
4.2.1 Audit after QC 100% Inspection
在 QC 100% 检验后进行抽验.
IPQA randomly check 5pcs boards/panels per hour (If other document like WI, PMP define the sampling requirement, we can follow it and PMP is preferred) after QC inspection in the process. If the defect was found and confirmed by CQE, IPQA issue the reject report (CELQ-075-FORM-228) to the responsible supervisor to request investigation and corrective action. The failure lot should be re-screen.
IPQA 每个小时,随机地抽取 5pcs boards/panels( 如果别的文件如 WI, PMP 有规定抽样计划,参照他们, PMP 优先 ), 这些板是已经过 QC 检验的. 如有不良发现并得到CQE 确认, IPQA 发出拒收单( CELQ-075-FORM-228) 给相关的主管, 要求他们做调查并提出改善措施. 有不良的那批货必须返工.
4.2.2 Aqueous Cleaning Station (if available) Aqueous 清洗工站( 如果需要 )
IPQA shall randomly take at least 1pcs PCBA per one shift to perform ionic contamination test after aqueous cleaning. (Except \"No Clean Flux\" PCBAs & PCBAs consist of components which cannot be immersed in IPA solution.). Record the test result into relative form. If the defect was found and confirmed by CQE, IPQA issue the reject report (CELQ-075-FORM-228) to the responsible supervisor to request ivestigation and corrective action. The failure lot should be rework.
IPQA 每个班次, 对于用 aqueous 清洗的, 随即地抽取1pc PCBA 进行离子污染测试
( 免洗松香的除外, PCBAs&PCBAs 包含元件的不能浸入 IPA 溶液中 ). 记录结果于相应的表格中, 如果有不良发现并得到 CQE 确认, IPQA 发出拒收报告
( CELQ-075-FORM-228) 给相关的主管, 要求调查并提供改进措施. 不良的那一批必须返工.
4.2.3 PROM/EPROM Programming Audit
IPQA shall check the marking on the master PROM/EPROM with the corresponding document and verify the check sum every two hours or by batch. And record the result into the form ---CELQ-075-FORM -448 ( 抽样计划: C=0& AQL=1.5). If the defect was found and confirmed by CQE, IPQA issue the
(CELQ-075-Form -275) to responsible supervisor to request ivestigation and corrective action inmmediately.
IPQA 依据相关的文件, 每两小时或每批检查 PROM/EPROM 的标识和核对 check sum. 记录结果入表格 --- CELQ-075-FORM-448( 抽样计划: C=0& AQL=1.5). 如果有不良并得到CQE 确认, IPQA 发出 ( CELQ-075-Form-275) 给相关的主管,要求马上调查和提供改善行动.
4.3 SPC pre-control system (Refer to CELQ-075-PROC-50)
The inspection process and test process are implement SPC computerized system to monitor process yield if necessary. When the yields be lower than target, SPC system will auto alarm. The relative department should write down the RCCA in the SPC system or Stop Line Order.
如果必要,会在检查和测试流程实施 SPC 电脑化以监控制程良率. 一旦良率低于目标时,SPC 会自动报警.收到报警的相关部门需要在SPC系统或停拉单上写明原因和改善行动。具体参考CELQ-075-PROC-50。
4.4 Form \"SMT(w/s) Line Daily Audit Report\"/ \"Process Ivestigation Request\"/\"Stop line Order\" Application
4.4.1 QA auditor should issue a \"IPQA Line Audit Check list and Report\"/CA to responsible area supervisor or responsible engineer to request investigation
and/or corrective actions if any out of control condition was found.
当发现有超出控制范围的, QA 稽查者发出 “a \"IPQA Line Audit Check list and Report\"/CA ” 给责任区的主管或工程师, 要求调查和提供改善行动.
4.4.2 The responsible area supervisor or Responsible Engineering who owned the \"SMT (w/s) Line Daily Report\"/ must review and investigate all the process parameters and the handling methods and take immediate corrective actions for any non-conformance. If necessary, QA will on hold all products that have been produced and call relevant departments to dispose of those products.
责任区的主管和工程师必须检讨和调查流程参数和相关的处理方法, 并采取立即措施. 如果需要, QA 可以要求暂停出货, 并要求相关部门处理货物.
The estimated completion time for the actual cause of discrepancy and the corrective actions shall be stated on \"IPQA Line Audit Check list and Report”/ CA and the Report shall be completed within two working hours. If responsible person is not able to identify problem source during his preliminary process review and investigation, he shall request help of the concerned Engineering Department and request corrective actions. The concerned Engineer shall provide a estimated completion time for deep investigation and corrective actions on the SMT (w/s) Line Daily Report\"/. The \"SMT (w/s) Line Daily Report\"/ shall be responded within four working hours upon receipt.
预计完成原因和改善行动应在两个工作小时. 如果责任人不能找出原因, 他应该向有关的工程部门请求帮助. 相关的工程师应提供原因分析和改善措施的预计完成时间. 在收到 \"IPQA Line Audit Check list and Report”/ CA 后 的两个小时内必须作出反应.
4.4.3 The problematic station shall be re-audited by auditor for verification of effective corrective actions after the estimated completion time that was stated on \"IPQA Line Audit Check list and Report”/ CA. If the non-conformance is still existing, another SMT (w/s) Line Daily Report\"/ shall be issued by auditor. Meanwhile, the problematic station should be requested to shut down for deep investigation and issue CAR to responsible department to provide proper corrective action by CQE if necessary.
稽查者应该重新稽核有问题的工位, 以验证改善行动的有效. 如果不符合项依然存在, 另外一张 IPQA Line Audit Check list and Report”/ CA 在发出. 同时问题工位应停止作业,并进行深入的调查和采取改善措施.
4.4.4 Before putting the suspended station back into normal production, C.A. meeting shall be held and the production should solved the problem before informing QA of \" Resuming \"audit. Re-audit may be performed after the deviation is corrected. The problematic station can then be resumed to normal production.
在问题工位恢复到正常生产之前, C.A 会议必须开,并且解决掉问题. 重新稽核也许会
采用, 确认偏离的问题已得到纠正后,问题工位恢复到正常生产.
4.4.5 Production supervisor will issue SLO when process yield in a certain period is less than the yield target and state the problem to resopnsibe department. CQE will sign on SLO to approve it after confirming the situation. Production supervisor shall stop the line /station while getting CQE’s approval, then inform related ME / TE /TEM / EE supporting personnel to verify and solve the problem immediately.
当制程良率低于目标良率时, 生产主管应发出 SLO 给责任部门, CQE 已确认后, 签名于 SLO 上. 生产主管在得到 CQE 的同意下,应停线或相关工站停止运作,通知相关的 ME/TE / TEM/EE 等相关部门应立即去核对, 解决问题.
4.4.6 20 pcs samples shall be run and verified by QA to resume production, the cause &corrective action shall be recorded with responsible people’s signature on the RLO from as well. Production can be resumed after CQE signs on RLO.
应生产20pcs样品, 经 QA 检验合格后恢复生产, 原因和改善措施应记录于 RLO 单上, 同时相关的责任人必须签名. 生产线可以恢复生产, 一旦 CQE 签名于 RLO 上.
4.5 Record Retention 记录的保留
Description of Quality Records Audit Report/ SPC
质量记录描述 稽核报告 统计管制图
Minimum Retention Period 1 year 6 Months
最少的保留期限 1 年 6 个月
Method of Storage Hardcopy Hardcopy
保留方法 纸张 纸张
Responsible Department QA Production
责任部门 品保部 生产线
5.1. QA Quality Assurance 品质保证
5.2. EE Equipment Engineering 设备工程
5.3. ME Manufacturing Engineering 制造工程
5.4. SMT Surface Mounting Technology 表面贴装技术
5.5. Statistical Process Control (SPC) 统计制程管制
This technique applies to control the process with measurable or un-measurable parameters such as machine temperature, conveyor
speed,defective rate and etc. The control limit of SPC is in term of standard deviation (2 and 3 sigma) which is calculated with statistically formula.The SHEWHART CONTROL CHART(CELQ-075-FORM-264) or ATTRIBUTE CONTROL CHART(CELQ-075-FORM-266)
此技术应用于控制可测量或不可测量的参数, 如机器的温度, 输送带的速度, 缺点率 等等. SPC 的控制界限是标准方差( 2 and 3 sigma ), 它是通过统计公式计算出来的.
5.6. Specification Limit Control (SLC)
SLC is only used to record the measurable data for equipment maintainance/monitoring such as monitoring the temperature of fridge where the SPC is not applicable, SLC can show a more visible vision on the data to meet the specification comparing with sheet record.The specification limit shall be provided by engineering authority. The SLC chart (CELQ-075-FORM-265) applies to the data record.
SLC 是用于记录可测量的数据, 这些数据仅是记录设备的维护及监控, 例如, 监控冰箱的温度. 相对于表格记录而言SLC更能明显的展示数据是否符合规格. SLC中的控制规格由工程部门提供. SLC 图应用于记录资料.
5.7 SLO--Stop Line Order, a former to apply and record stopping line and resuming line due to quality issues
SLO--停拉通知, 一种用于申请,记录源于质量问题的停拉以及恢复生产的表格
5.8 C/A---Corrective Action, 纠正措施
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