专利名称：Method for producing an electronic
component with shielding
发明人：Robert-Christian Hagen,Gerald Ofner申请号：US11387403申请日：20060323
公开号：US20060183306A1公开日：20060817
专利附图：
摘要：An electronic component with shielding is described. The component has asemiconductor chip with a semiconductor substrate. Disposed in a region of a rear side ofthe semiconductor substrate is an electrically conductive buried layer. The buried layer is
connected via a ground lead, disposed within the semiconductor substrate, to a contactarea and an external ground potential. Furthermore, the invention relates to a methodfor producing an electronic component of this type.
申请人：Robert-Christian Hagen,Gerald Ofner
地址：Barbing DE,Bad Abbach DE
国籍：DE,DE
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