专利名称：Semiconductor substrates with unitary vias
and via terminals, and associated systemsand methods
发明人：Kyle K. Kirby,Kunal R. Parekh申请号：US13241059申请日：20110922公开号：US08629057B2公开日：20140114
专利附图：
摘要：Semiconductor substrates with unitary vias and via terminals, and associatedsystems and methods are disclosed. A representative method in accordance with a
particular embodiment includes forming a blind via in a semiconductor substrate,applying a protective layer to a sidewall surface of the via, and forming a terminalopening by selectively removing substrate material from an end surface of the via, whileprotecting from removal substrate material against which the protective coating isapplied. The method can further include disposing a conductive material in both the viaand the terminal opening to form an electrically conductive terminal that is unitary withconductive material in the via. Substrate material adjacent to the terminal can then beremoved to expose the terminal, which can then be connected to a conductive structureexternal to the substrate.
申请人：Kyle K. Kirby,Kunal R. Parekh
地址：Eagle ID US,Boise ID US
国籍：US,US
代理机构：Perkins Coie LLP
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