专利名称：THERMOPILE MESH发明人：Ali Akbar MERRIKH,Farsheed
MAHMOUDI,Mehdi SAEIDI,Evan BentleyFLEMING
申请号：US15675604申请日：20170811
公开号：US20180045580A1公开日：20180215
专利附图：
摘要：A semiconductor device may include a semiconductor die having an activeregion. The semiconductor device may also include a thermocouple mesh proximate to
the active region. The thermocouple mesh may include a first set of wires of a firstmaterial extending in a first direction, and a second set of wires of a second material. Thesecond material may be different from the first material. In addition, the second set ofwires may extend in a second direction different than the first direction of the first wires.
申请人：QUALCOMM Incorporated
地址：San Diego CA US
国籍：US
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